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HYDE is a flexible design-system
for the development
of hybrid circuits,
MCMs and LTCCs with
a comprehensive thickfilm
and specific thinfilm
resistor-design. The
system is based on the
powerful graphics editor
GraffyBAS and also contains
integrated modules for
the creation of electrical
Schematics and mechanical
drawings. The parts
database consists of
SMDs, Chip&Wire,
and wired parts. The
paste resistors may
have any shape and will
automatically be calculated
with the special database-information
based on scientific
rules. The system allows
to create layouts in
single-, multi-layer
and cross-over-technique.
The user can create
complex layouts within
a very short training
period because of the
easy to handle user
surface of the software
with additional pull-down
menus. A geometrical
and electrical design-rule-checker
is built in to test
distances between traces
and pads within dedicated
regions, and to check
the connectivity.
The thermal analysis
shows its results directly
on the layout.
An easy to use macro
interpreter is built
in to create user-defined
commands to customize
the system for individual
needs. Numerous software
interfaces and post
processors are available
for the direct connection
to production-machines.
Schematic
Module (SCH)
A
large library of symbols
accessible to all users
will make the generation
of schematics very easy.
All symbols can be placed
with the necessary attributes
(like reference designator,
type, inputs and outputs,
footprints, part-no.
etc.). All net- and
parts list information
are available immediately
after completion of
the schematic. Parts
and groups of a schematic
can even be moved, modified
and copied block wise.
Even complex schematic
circuits with several
hundreds of symbols
are automatically referenced
within seconds. The
starting value for referencing
can be defined individually
per group, or the whole
schematic, or parts
of it can be referenced
manually. When all symbols
are numbered they can
be aligned horizontally-,
or vertically in a second
step either manually,
or automatically.
Hybrid Layout Module
(HLM)
This
module offers a large
number of special functions
for an efficient design
of hybrid circuits.
HYDE uses a special
layout structure of
more then 200 layers
(out of 8000) to create
hybrid layouts. This
structure allows double
sided layouts with at
least 5 trace layers
on each side and 3 isolation
layers between each
trace layer. 26 layers
on each side are reserved
for the resistor pastes,
and many additional
layers are available
for documentation purposes.
The whole layer structure
can be adapted to individual
user needs if necessary.
For
users who design hybrid
circuits or PCBs mostly
different design entry
packages are used for
the creation of schematics.
In these cases you can
easily assign a footprint
to an existing net list
to transfer all necessary
data without much effort
into the layout module
of HYDE. It is also
possible to start with
the layout right from
scratch without drawing
a schematic. After
all the schematic information
have been transferred
to the layout any point-to-point-connection
between the parts can
be routed individually
by choosing a variable
trace width on any layer.
When routing traces
(with lines and arcs)
the chosen width and
the rounded bumps are
directly displayed on
the screen. While routing
the layout a chosen
DRC separation will
be seen directly at
the trace to be drawn.
Within the hybrid
layout module isolation
prints (Crossovers)
for trace crossings
can be created individually,
but also automatically
with different geometry.
For example, 3
isolation layers can
be printed on top of
one another. The top
layers can be defined
with a specific predefined
offset to be smaller
as the deeper layer
(with the OFFSET-command)
to achieve a staircase-effect.
Features
of HLM:
- Single
layer-, cross
over-, and multi
layer technique
- Design:
grid based or
grid less
- With
integrated material-
and net list
creation
- Transfer
of paste resistors
with trim
cuts into the
layout
- Traces
can be routed
with the support
of any lock
angle
- Easy
routing of any
point-to-point
connection between
2 parts; Vias
are set automatically
- Interactive
editing or calculation
redesign of
placed paste
resistors
- Individual
assignment of
component pads
(bond- and resistor
pads) to different
trace layers
- Parts
can be easily
moved from top-
to bottom side
(or vice versa)
with all their
associated information
- Automatic
calculation
of particular
paste quantity
- Determination
of bond wire
length with
warning messages
when exceeded
predefined limits
- Resistor
values from
any trace can
be determined
(when drawn
as lines) between
two points
- Crosshatched
ground- and
power-planes
can be generated
very comfortably
with the HATCH-command.
Width and distance
of the hatch
lines are variable
parameters which
are considered
in the photo
plot post process
to generate
precise production
of any plane.
- Interfaces
to several post
processors for
photo plotting,
drill and mill
machine as well
as pick&place
machines and
laser trimming
systems
- Support
of SMD, chip&wire
technology,
and MCM circuits
- Semi
automatic generation
of Cross-Over
structures with
different shape
and size definitions
- Using
several isolation
layers with
programmable
staircase effect
LTCC Module
For the development of LTCC circuits special functions
are required, which are usually not offered by conventional EDA systems. HYDE
processes up to 50 green tapes with approx. 100 information layers per tape.
Additionally on both exterior sides of the ceramic up to 5 printed trace layers
(hybrid layers, with up to 3 isolation layers per trace layer) are available.
Since LTCC circuits are very often used for RF applications because of their
outstanding RF characteristics, on the one hand sophisticated graphical functions
are necessary and on the other hand complex circuits have to be developed fast
and reliable with comfortable routing tools. Both characteristics are fulfilled
with the LTCC Module in its best way.
Due to the high flexibility and openness of HYDE also
unusual technologies can be realized. So e.g. buried DIEs can be placed, with
the possibility of bonding on different tapes/layers. In that case the Design
Rule Check takes all these features into account. The LTCC-specific DRC allows
an error free development of complex circuits. By a comfortable copying
function polygonal tape as well as cavity structures can be easily transferred
to any other tapes, so that the use of buried DIEs can be applied fast.
For the development of RF applications the placement of
buried RF structures, resistors, capacities and inductors are essential. With HYDE they can be placed on
any tape as well in between. RF layouts simulated with ADS simulation software
(from Agilent) can also be imported into the parts library of HYDE, whereby a
very simple handling between ADS and HYDE is given.
With its modern 2-Point-Router tool HYDE supports in a simple
way very high complex structures and uses thereby arbitrary sizes and shapes of
VIAs (also thermal VIAs). They can be defined individually. With the
2-Point-Autorouter electrical connections are routed very comfortably by
clicking the airline. The trace will be routed automatically according to the
design rules. The direction of the trace inclusively intermediate stops can be
directly affected with the cursor position after the "Follow Me"
principle. By the variable VIA selection routing is also possible between the
tapes.
When creating the manufacturing data the shrinking
process of the ceramic tapes of LTCC circuits during the sinter process is
considered. With the comfortable integrated CAM
interface any step and repeat of the layout is displayed on the film with all
layers to be printed including fiducial marks and a legend. These data can be
converted into the Gerber or GDSII format within seconds.
LTCC
cross section LTCC-Screenshot
Design-Rule-Check
(DRC)
If
the predefined trace
distance is not kept
while routing, or a
short circuit is produced
a warning immediately
appears on the screen
reporting that an online
rule has been violated.
To obtain a reasonable
overview during the
routing process it is
possible to display
only one single net
(with its airlines).
After this net has been
completely routed the
corresponding airline
automatically disappears.
This allows to route
manually even complex
layouts systematically
and error free. The
DRC also recognizes
if a cross-over-isolation
is placed correctly.
There are no vias necessary
when placing cross-overs.
In the layout all bond
wires can be checked
with given limitations.
A comprehensive report
will be produced containing
all connections.
2-Point-Router
The
2-Point-Router is an
auto router with interactive
influence working after
the "Follow-Me"
principles. It routes
a trace (net) between
2 points by itself.
It helps in routing
LTCC, hybrid thickfilm as well as
PCB-circuits. Its mode
of operation is grid
less and 45° oriented.
All rules and distances
defined in the DRC are
taken into consideration
as well as all existing
keep outs in the layout.
First the start- and
ending point of a net
is defined, for example,
by picking an airline.
The direction for the
automatic routing process
can then be influenced
by the cursor position.
As long as the routed
trace is not finished
completely the trace
stays highlighted. In
comparison with the
interactive manual routing
the 2-point-router is
an essential acceleration,
and error reduction
during the whole routing
process. Because every
net is controlled separately
there are no rubbish
connections as if working
with an All over auto
router.
Hybrid
Resistor Design (HPD)
Within
any hybrid design system
the resistor design
process is of particular
significance for the
hybrid circuit quality.
The accuracy of the
resistor calculation
has a direct effect
on the size and thus
on the space needed
on the board. The
extensive system know-how
necessary for developing
such a highly competitive
Hybrid Resistor Module
resulted from our cooperation
with a Technical University.
This university has
made research in that
field for more than
10 years. A block
diagram of the Hybrid
Resistor Design concept
is shown in the following
screen shots. To
calculate paste resistors,
HYDE needs two kinds
of information: measurement
data of test substrates
and technology data.
These measurement data
are obtained from test
substrates with the
help of measuring instruments,
and can be read in and
administrated in HYDE.
The technology data
that can be specified
in the following technology
groups are contained
in another system menu:
- Pastes
of various manufacturers
e.g. Heraeus,
DuPont, ESL,
etc.
- Paste
quantity resistor
factors
- Substrates
e.g. ceramics,
steel, dielectric
- Number
of burn-ins
- Trace
material e.g.
silver, silver
palladium, gold
If
the measurement data
that must be read in
can be seen in the system
menu. The data can be
taken directly into
the system. Should,
for example, a paste
of a certain manufacturer
not yet exist in the
system menu, the user
is able to extend the
system menu for that
specific new paste and
can then read in the
relevant measurement
data. Such customer-specific
adaptations guarantee
the integration of future
technology. Every
series of paste measurement
data is assigned to
a specific technology
adjustment. Since each
resistor value depends
on its resistor geometry
(there is no linear
behaviour of the sheet
resistivity) all resistors
have to be calculated
individually. This is
done with the help of
the measurement data
that is stored in the
system. The measurement
database establishes
the base for future
resistor designs and
can be updated with
every new paste or different
trace material.
The actual resistor
design starts using
a comfortable windows-based
user interface and begins
with the specification
of the technology. The
user then selects the
resistor geometry, depending
on the size of the substrate
and the electrical characteristics
needed. HYDE supports
the following predefined
resistor geometry:
- Rectangle
- Top
hat
- Top
hat with roof
- U-form
- U-form
with roof
- Serpentine
- Serpentine
with roof
- Angle
- Double
angle
- Three-sided-contact
After
choosing a specific
resistor geometry the
different parameter
information of that
resistor geometry must
be set. The Resistor
Dimensioning Module
offers several possibilities,
for example:
- Trim
cut tolerance
and resistor
value
- Power
dissipation
and resistor
value
- Length
and resistor
value
- Paste
area and resistor
value
- Length
and width of
resistor
These
design options
offer a maximum of flexibility
in enabling the user
to operate comfortably
and accurately.
After setting the basic
parameters the user
can enter additional
specifications like
pad size, pad overlapping,
etc. The system then
presents all relevant
data of the calculated
resistor. To achieve
an optimum accuracy
of a resistor, the paste
resistors can be trimmed
to a certain value using
the trim cut analysis
feature. By doing so,
misproduction is avoided
and the specific circuit
performance is guaranteed.
The system is able to
supply all data needed
for an active resistor
balancing to achieve
the highest possible
accuracy. The resistor,
determined in this way,
is saved as a graphical
macro. The user can
pick this resistor part
from the screen menu
and place it in the
HYDE layout editor (HLM).
With a click on that
resistor all related
parameter information
are displayed in a toolbox
and can be edited subsequently.
Polygon
Shape Resistor Analysis
(PSRA)
Creating
thickfilm resistors
of any shape
Using
this command, hybrid
resistors can be defined
of any polygonal shape.
The connector pads can
be placed at any position
at the polygon border.
This allows the designer
to use even the smallest
space on the ceramic-board
in an optimal way. Subsequent
changes of the layout
because of a lack of
space are problems of
the past, and an increased
miniaturisation of the
layout is automatically
given. If this
command is used for
thickfilm resistors,
the geometrical resistor
database is taken into
account for any calculations.
This command can also
be used for the design
of thinfilm resistors.
Available
as option
Thinfilm-Resistor-Dimensioning
(CTFR)
This
command allows to create
thinfilm-resistors which
are commonly used in
high quality electronic
systems.
The
following steps are
necessary to create
a thinfilm-resistor:
1.
Definition of all parameters
like: Sheet
resistivity, resistor
target value, resistor
trace width, process
accuracy and
others
2.
Determine the geometrical
shape for the thinfilm-resistor
3.
Place the resistor connection
pads at any position
Like
described above a TFR
can be defined, calculated
and dimensioned within
seconds, very precisely.
The TFR can then be
trimmed, while the lower
section of the serpentines
(Rough- and/or middle
trim) will be opened
and as fine trim the
wide thinfilm trace
at the lowest end will
be cut longitudinal.
Available
as option
Thermal
Simulation
The trend to a higher
density of packaging
in electronic circuits
easily leads to thermal
problems. The thermal
simulation allows -
while still in the design
process - to discover
the unexpected temperature
peaks. This means that
before a hybrid is brought
into production possible
defects are found and
a redesign is started
to prevent loss.
Interfaces
The
following interfaces
and data exchange formats
are supported by the
HYDE software:
- Graphical
and mechanical
systems
- Electronic
Design systems
- CAM
systems
List
of interfaces
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