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HYDE brochure in PDF format (2,4 MB)


HYDE is a flexible design-system for the development of hybrid circuits, MCMs and LTCCs with a comprehensive thickfilm and specific thinfilm resistor-design. The system is based on the powerful graphics editor GraffyBAS and also contains integrated modules for the creation of electrical Schematics and mechanical drawings. The parts database consists of SMDs, Chip&Wire, and wired parts. The paste resistors may have any shape and will automatically be calculated with the special database-information based on scientific rules. The system allows to create layouts in single-, multi-layer and cross-over-technique. The user can create complex layouts within a very short training period because of the easy to handle user surface of the software with additional pull-down menus. A geometrical and electrical design-rule-checker is built in to test distances between traces and pads within dedicated regions, and to check the connectivity.
The thermal analysis shows its results directly on the layout.
An easy to use macro interpreter is built in to create user-defined commands to customize the system for individual needs. Numerous software interfaces and post processors are available for the direct connection to production-machines.   

 

Schematic Module (SCH)

A large library of symbols accessible to all users will make the generation of schematics very easy. All symbols can be placed with the necessary attributes (like reference designator, type, inputs and outputs, footprints, part-no. etc.). All net- and parts list information are available immediately after completion of the schematic. Parts and groups of a schematic can even be moved, modified and copied block wise.
Even complex schematic circuits with several hundreds of symbols are automatically referenced within seconds. The starting value for referencing can be defined individually per group, or the whole schematic, or parts of it can be referenced manually. When all symbols are numbered they can be aligned horizontally-, or vertically in a second step either manually, or automatically.
 

Example Screenshots

 

 


Hybrid Layout Module   (HLM)

This module offers a large number of special functions for an efficient design of hybrid circuits.
HYDE uses a special layout structure of more then 200 layers (out of 8000) to create hybrid layouts. This structure allows double sided layouts with at least 5 trace layers on each side and 3 isolation layers between each trace layer. 26 layers on each side are reserved for the resistor pastes, and many additional layers are available for documentation purposes. The whole layer structure can be adapted to individual user needs if necessary.

For users who design hybrid circuits or PCBs mostly different design entry packages are used for the creation of schematics. In these cases you can easily assign a footprint to an existing net list to transfer all necessary data without much effort into the layout module of HYDE. It is also possible to start with the layout right from scratch without drawing a schematic.
After all the schematic information have been transferred to the layout any point-to-point-connection between the parts can be routed individually by choosing a variable trace width on any layer. When routing traces (with lines and arcs) the chosen width and the rounded bumps are directly displayed on the screen. While routing the layout a chosen DRC separation will be seen directly at the trace to be drawn.
Within the hybrid layout module isolation prints (Crossovers) for trace crossings can be created individually, but also automatically with different geometry.  For example, 3 isolation layers can be printed on top of one another. The top layers can be defined with a specific predefined offset to be smaller as the deeper layer (with the OFFSET-command) to achieve a staircase-effect.

Features of HLM:

  • Single layer-, cross over-, and multi layer technique
  • Design: grid based or grid less
  • With integrated material- and net list creation
  • Transfer of paste resistors with  trim cuts into the layout
  • Traces can be routed with the support of any lock angle
  • Easy routing of any point-to-point connection between 2 parts; Vias are set automatically
  • Interactive editing or calculation redesign of placed paste resistors
  • Individual assignment of component pads (bond- and resistor pads) to different trace layers
  • Parts can be easily moved from top- to bottom side (or vice versa) with all their associated information
  • Automatic calculation of particular paste quantity
  • Determination of bond wire length with warning messages when exceeded predefined limits
  • Resistor values from any trace can be determined (when drawn as lines) between two points
  • Crosshatched ground- and power-planes can be generated very comfortably with the HATCH-command. Width and distance of the hatch lines are variable parameters which are considered in the photo plot post process to generate precise production of any plane.
  • Interfaces to several post processors for photo plotting, drill and mill machine as well as pick&place machines and laser trimming systems
  • Support of SMD, chip&wire technology, and MCM circuits
  • Semi automatic generation of Cross-Over structures with different shape and size definitions
  • Using several isolation layers with programmable staircase effect

Example Screenshots

 

 

LTCC Module

For the development of LTCC circuits special functions are required, which are usually not offered by conventional EDA systems. HYDE processes up to 50 green tapes with approx. 100 information layers per tape. Additionally on both exterior sides of the ceramic up to 5 printed trace layers (hybrid layers, with up to 3 isolation layers per trace layer) are available. Since LTCC circuits are very often used for RF applications because of their outstanding RF characteristics, on the one hand sophisticated graphical functions are necessary and on the other hand complex circuits have to be developed fast and reliable with comfortable routing tools. Both characteristics are fulfilled with the LTCC Module in its best way.

Due to the high flexibility and openness of HYDE also unusual technologies can be realized. So e.g. buried DIEs can be placed, with the possibility of bonding on different tapes/layers. In that case the Design Rule Check takes all these features into account. The LTCC-specific DRC allows an error free development of complex circuits. By a comfortable copying function polygonal tape as well as cavity structures can be easily transferred to any other tapes, so that the use of buried DIEs can be applied fast.

For the development of RF applications the placement of buried RF structures, resistors, capacities and inductors are  essential. With HYDE they can be placed on any tape as well in between. RF layouts simulated with ADS simulation software (from Agilent) can also be imported into the parts library of HYDE, whereby a very simple handling between ADS and HYDE is given.

With its modern 2-Point-Router tool HYDE supports in a simple way very high complex structures and uses thereby arbitrary sizes and shapes of VIAs (also thermal VIAs). They can be defined individually. With the 2-Point-Autorouter electrical connections are routed very comfortably by clicking the airline. The trace will be routed automatically according to the design rules. The direction of the trace inclusively intermediate stops can be directly affected with the cursor position after the "Follow Me" principle. By the variable VIA selection routing is also possible between the tapes.

When creating the manufacturing data the shrinking process of the ceramic tapes of LTCC circuits during the sinter process is considered. With the comfortable integrated CAM interface any step and repeat of the layout is displayed on the film with all layers to be printed including fiducial marks and a legend. These data can be converted into the Gerber or GDSII format within seconds.

LTCC cross section

LTCC-Screenshot

Design-Rule-Check (DRC)

If the predefined trace distance is not kept while routing, or a short circuit is produced a warning immediately appears on the screen reporting that an online rule has been violated.
To obtain a reasonable overview during the routing process it is possible to display only one single net (with its airlines). After this net has been completely routed the corresponding airline automatically disappears. This allows to route manually even complex layouts systematically and error free. The DRC also recognizes if a cross-over-isolation is placed correctly. There are no vias necessary when placing cross-overs.
In the layout all bond wires can be checked with given limitations. A comprehensive report will be produced containing all connections. 
 

Example Screenshot

 

 

2-Point-Router

The 2-Point-Router is an auto router with interactive influence working after the "Follow-Me" principles. It routes a trace (net) between 2 points by itself. It helps in routing LTCC, hybrid thickfilm as well as PCB-circuits. Its mode of operation is grid less and 45° oriented. All rules and distances defined in the DRC are taken into consideration as well as all existing keep outs in the layout. First the start- and ending point of a net is defined, for example, by picking an airline. The direction for the automatic routing process can then be influenced by the cursor position. As long as the routed trace is not finished completely the trace stays highlighted. In comparison with the interactive manual routing the 2-point-router is an essential acceleration, and error reduction during the whole routing process. Because every net is controlled separately there are no rubbish connections as if working with an All over auto router.
 

Example Screenshot

 

 


Hybrid Resistor Design (HPD)

Within any hybrid design system the resistor design process is of particular significance for the hybrid circuit quality. The accuracy of the resistor calculation has a direct effect on the size and thus on the space needed on the board.
The extensive system know-how necessary for developing such a highly competitive Hybrid Resistor Module resulted from our cooperation with a Technical University. This university has made research in that field for more than 10 years.
A block diagram of the Hybrid Resistor Design concept is shown in the following screen shots.
To calculate paste resistors, HYDE needs two kinds of information: measurement data of test substrates and technology data.
These measurement data are obtained from test substrates with the help of measuring instruments, and can be read in and administrated in HYDE.
The technology data that can be specified in the following technology groups are contained in another system menu:
 

Example Screenshots

 

  • Pastes of various manufacturers e.g. Heraeus, DuPont, ESL, etc.
  • Paste quantity resistor factors
  • Substrates e.g. ceramics, steel, dielectric
  • Number of burn-ins
  • Trace material e.g. silver, silver palladium, gold

 If the measurement data that must be read in can be seen in the system menu. The data can be taken directly into the system. Should, for example, a paste of a certain manufacturer not yet exist in the system menu, the user is able to extend the system menu for that specific new paste and can then read in the relevant measurement data. Such customer-specific adaptations guarantee the integration of future technology.
Every series of paste measurement data is assigned to a specific technology adjustment. Since each resistor value depends on its resistor geometry (there is no linear behaviour of the sheet resistivity) all resistors have to be calculated individually. This is done with the help of the measurement data that is stored in the system.
The measurement database establishes the base for future resistor designs and can be updated with every new paste or different trace material.
The actual resistor design starts using a comfortable windows-based user interface and begins with the specification of the technology. The user then selects the resistor geometry, depending on the size of the substrate and the electrical characteristics needed.
HYDE supports the following predefined resistor geometry:

  • Rectangle
  • Top hat
  • Top hat with roof
  • U-form
  • U-form with roof
  • Serpentine
  • Serpentine with roof
  • Angle
  • Double angle
  • Three-sided-contact

After choosing a specific resistor geometry the different parameter information of that resistor geometry must be set. The Resistor Dimensioning Module offers several possibilities, for example:

  • Trim cut tolerance and resistor value
  • Power dissipation and resistor value
  • Length and resistor value
  • Paste area and resistor value
  • Length and width of resistor

These design options offer a maximum of flexibility in enabling the user to operate comfortably and accurately.
After setting the basic parameters the user can enter additional specifications like pad size, pad overlapping, etc. The system then presents all relevant data of the calculated resistor.
To achieve an optimum accuracy of a resistor, the paste resistors can be trimmed to a certain value using the trim cut analysis feature. By doing so, misproduction is avoided and the specific circuit performance is guaranteed.
The system is able to supply all data needed for an active resistor balancing to achieve the highest possible accuracy.
The resistor, determined in this way, is saved as a graphical macro. The user can pick this resistor part from the screen menu and place it in the HYDE layout editor (HLM). With a click on that resistor all related parameter information are displayed in a toolbox and can be edited subsequently.
 

Example Screenshots

 

 


Polygon Shape Resistor Analysis (PSRA)

Creating thickfilm resistors of any shape

Using this command, hybrid resistors can be defined of any polygonal shape. The connector pads can be placed at any position at the polygon border. This allows the designer to use even the smallest space on the ceramic-board in an optimal way. Subsequent changes of the layout because of a lack of space are problems of the past, and an increased miniaturisation of the layout is automatically given.
If this command is used for thickfilm resistors, the geometrical resistor database is taken into account for any calculations. This command can also be used for the design of thinfilm resistors.

Available as option
 

Example Screenshots

 

 

Thinfilm-Resistor-Dimensioning (CTFR)

This command allows to create thinfilm-resistors which are commonly used in high quality  electronic systems.

The following steps are necessary to create a thinfilm-resistor:

  1. Definition of all parameters like:
     Sheet resistivity,
     resistor target value,
     resistor trace width,
     process accuracy
     and others

  2. Determine the geometrical shape for the thinfilm-resistor

  3. Place the resistor connection pads at any position

Like described above a TFR can be defined, calculated and dimensioned within seconds, very precisely. The TFR can then be trimmed, while the lower section of the serpentines (Rough- and/or middle trim) will be opened and as fine trim the wide thinfilm trace at the lowest end will be cut longitudinal.

Available as option

 

Example Screenshots

 

 

Thermal Simulation
The trend to a higher density of packaging in electronic circuits easily leads to thermal problems. The  thermal simulation allows - while still in the design process - to discover the unexpected temperature peaks. This means that before a hybrid is brought into production possible defects are found and a redesign is started to prevent loss.
 

Example Screenshots

 

 


Interfaces

The following interfaces and data exchange formats are supported by the HYDE software:

  • Graphical and mechanical systems
  • Electronic Design systems
  • CAM systems

   List of interfaces

 

 
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